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Micron smartphone flashery

Micron has got itself 32GB, 32-layer, 3D NAND smartphone flash chips.

The chips support the Universal Flash Storage (UFS) 2.1 standard and are for high-end and mid-range smartphones. The UFS 2.1 support should mean good sequential read performance. Hopefully smartphones using these chips get more storage and can keep more stuff, like photos, music and videos, onboard and play music and videos better.

Micron says these 3D NAND memory chips measure 60.217mm2. The die size enables a memory packaging footprint that can free up space for additional mobile battery size or enable smaller form factor devices. The 3D NAND die is up to 30 per cent smaller than a planar NAND die of the same capacity.

These mobile chips are sampling with mobile customers and partners, and will be widely available by the end of 2016. Expect higher capacity smartphones in 2017. ®

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