The Channel logo

News

By | Chris Mellor 7th December 2010 10:07

Samsung readies less sockety servers for 3D stacked memory

RDIMM skyscrapers cram in more bits with less footprint

Samsung has worked out a way to stack memory chips vertically, increasing memory density and decreasing power needs.

It says next-generation servers are going to have fewer memory sockets – 30 per cent fewer – implying that unless you can stick more memory in a socket, you're going to have less of the stuff.

What it's done is to stack 40nm-class RDIMM memory chips vertically using "through-silicon vias" (TSVs), micron-sized vertical holes through the silicon, with a copper filling. It first said it was going to use this technology in 2007.

Samsung claims that by using its TSV bonding process instead of conventional wire bonding, "signal lines are shortened significantly, enabling the multi-stacked chip to function at levels comparable to a single silicon chip". An 8GB RDIMM built this way is reckoned to use just 40 per cent of the power needed by a conventional RDIMM.

The 3D stacking means memory density can rise by 50 per cent, even with a 30 per cent server memory slot decrease, according to Samsung spokespeople. Its new chips are being tested by customers and Samsung says it will use the 3D TSV stacking with 30nm-class chips. ®

comment icon Read 3 comments on this article alert Send corrections

Opinion

Houses of Parliament in night-time

Andrew Orlowski

Come on everybody, let's upload all our stuff into Government by Cloud
Joe Tucci EMC
frustration_anger_irritation_annoyance pain

Felipe Costa

Pressure to perform for stock market bearing down on disties
Columns of coins in the cloud

Michael Cote

Anything that simple to use has got to be complex to set up

Features

Alistair Darling and Alex Salmond debate Scottish independence
You keep the call centres, Hamish, we'll take the banks
Internet of Things
Everyone loves those Things, just not on each others' terms
No email? No CRM? No Daily Mail iPad edition? You need a plan
Sinofsky's hybrid strategy looks dafter than ever